黄明亮

大连理工大学教授

黄明亮，1970年生，博士研究生学历，教授，博士生导师。主要研究领域：电子封装中绿色环保无铅钎料与先进互连技术的研究。

个人简历

1992年、1995年、2001年在大连理工大学分别获学士、硕士、博士学位。

1998-2001年香港城市大学电子封装与组装中心；

2003-2004年韩国科学技术院（KAIST）电子封装材料中心；

2004年-2006年德国微电子与微系统集成研究院IZM芯片连接与先进封装部门进行研究。

2006年归国任教授。

社会兼职

美国TMS（矿物、金属、材料）学会会员。

《Journal of Materials Science and Technology》学术期刊编委。

国际期刊《Journal of Alloys and Compounds》，《Philosophical Magazine Letters》评阅人。

研究领域

[1] 国家自然科学基金重点项目：无铅化电子封装钎焊界面反应及焊点可靠性的基础研究(U0734006)、项目负责人。

[2] 国家自然科学基金面上项目：微凸点中电迁移与Sn晶粒取向相互作用研究（51475072）、项目负责人。

[3] 国家自然科学基金面上项目：单晶基体界面反应及其对微细无铅焊点可靠性的影响(51171036)、项目负责人。

[4] 国家自然科学基金国际合作与交流项目：可穿戴电子产品钎料-ACF柔性微互连Sn各向异性及电迁移行为研究（51511140289）、项目负责人。

[5] 国家自然科学基金国际合作与交流项目：无铅化电子封装中固/液界面反应研究(50811140338)、项目负责人。

[6] 国家自然科学基金国际合作与交流项目：2013年第十四届电子封装技术国际学术会议(51310305047)、项目负责人。

[7] 国家自然科学基金专项基金：从基体金属溶解的角度研究现代电子封装中固/液界面反应(50641007)、项目负责人。

[8] 国家科技支撑计划课题：无铅焊料系列产品的开发及产业化(2006BAE03B02)、170万元、项目负责人。

[9] 中国航天科技集团高校专项科研计划项目：倒装芯片焊陶瓷封装可靠性评估（20130731）、项目负责人。

[10] 军工项目、XXXXX、项目负责人。

[11] 国家教育部新世纪优秀人才支持计划项目：超薄芯片连接技术研究(NCET-06-0273)、项目负责人。

[12] 百千万人才工程项目：大功率高亮度氮化镓LED芯片倒装连接技术的研究(2009921058)、项目负责人。

[13] 国家教育部重点引智项目：无铅化电子封装钎焊界面反应的研究（200945）、项目负责人。

[14] 国家教育部博士点基金：无铅化电子封装固/液界面反应的基础研究（20070141062）、项目负责人。

[15] 国家教育部留学回国人员科研启动基金：大功率高亮度氮化镓LED芯片倒装连接的研究（[2007]1108）、项目负责人。

[16] 辽宁省自然科学基金项目：电子封装无铅微连接的基础问题（20082163）、项目负责人。

[17] 辽宁省自然科学基金项目：电子封装无铅钎料的研究（20021067）、项目负责人。

[18] 辽宁省重点实验室项目：微小尺寸无铅钎料连接技术（20060133）、项目负责人。

[19] 大连市科技计划重大项目：大功率低成本GaN基LED的封装技术与产业化（2006A11GX005）、项目负责人。

[20] 大连理工大学基本科研业务费重大项目培育专题：以先进焊接材料实现制冷行业铝代铜重大技术进步（DUT13ZD201）、项目负责人。

[21] 大连理工大学特色方向课题：集成电路特色专业方向建设、项目负责人。

[22] 华为技术有限公司等大型企业横向合作项目等。

著作论文

出版著作和论文

Scientific Reports, Applied Physics Letters, Journal of Applied Physics, Scripta Materialia, Journal of Materials Science, Journal of Materials Research, Journal of Electronic Materials, Journal of Alloys and compounds, IEEE Trans. On Advanced Packaging等刊物上发表的学术论文149篇。

2016年发表论文目录

[1] M.L. Huang, F. Yang, N. Zhao, Thermomigration-induced asymmetrical precipitation of Ag3Sn plates in micro-scale Cu/Sn-3.5Ag/Cu interconnects, Materials & Design, 89, pp. 116-120, 2016.

2015年发表论文目录

[1] M.L. Huang, F. Yang, N. Zhao, Z.J. Zhang, In situ study on dissolution and growth mechanism of interfacial Cu6Sn5 in wetting reaction, Materials Letters, 139, pp. 42–45, 2015.

[2] M.L. Huang, Z.J. Zhang, N. Zhao, F. Yang, In situ study on reverse polarity effect in Cu/Sn-9Zn/Ni interconnect undergoing liquid-solid electromigration, Journal of Alloys and Compounds, 619, pp. 667-675, 2015.

[3] L. Qu, N. Zhao, H.T. Ma, H.J. Zhao, M.L. Huang. In situ study on current density distribution and its effect on interfacial reaction in a soldering process. Journal of Electronic Materials, 44(1), pp.467-474, 2015.

[4] M. L. Huang, F. Yang, Size effect on interfacial reactions of Sn-3.0Ag-0.5Cu solder balls on Cu and Ni-P pads, Journal of Materials Science: Materials in Electronics, 26, pp.933–942, 2015.

[5] N. Zhao, M.L. Huang, Y. Zhong, H. T. Ma, X. M. Pan, Effects of rare earth Ce addition on the microstructure, wettability and interfacial reactions of eutectic Sn–0.7Cu solder, J Mater Sci: Mater Electron, 26, pp.345–352, 2015.

[6] M.L. Huang, F. Yang, Solder Size Effect on Early Stage Interfacial Intermetallic Compound Evolution in Wetting Reaction of Sn3.0Ag0.5Cu/ENEPIG Joints, Journal of Materials Science & Technology, 31(3), pp. 252-256, 2015.

[7] M. L. Huang, F. Zhang, F. Yang, N. Zhao, Size effect on tensile properties of Cu/Sn9Zn/Cu solder interconnects under aging and current stressing, Journal of Materials Science: Materials in Electronics, 26(4), pp.2278-2285, 2015.

[8] M.L. Huang*, Z.J. Zhang, N. Zhao, F. Yang, Migration behavior of indium atoms in Cu/Sn-52In/Cu interconnects during electromigration, Journal of Materials Research, 30(21), pp. 3316-3323, 2015.

[9] M.L. Huang*, J.F. Zhao, Z.J. Zhang, N. Zhao, Role of diffusion anisotropy in beta-Sn in microstructural evolution of Sn-3.0Ag-0.5Cu flip chip bumps undergoing electromigration, Acta Materialla, 100, pp. 98-106, 2015.

[10] M.L. Huang*, N. Zhao, Effect of Electromigration on the Type of Drop Failure of Sn-3.0Ag-0.5Cu Solder Joints in PBGA Packages, Journal of Electronic Materials, 44(10), pp. 3927-3933, 2015.

[11] N. Zhao, Y. Zhong, M.L. Huang, H.T. Ma, W. Dong, Growth kinetics of Cu6Sn5 intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient, Scientific Reports, 5, pp. 13491, 2015.

[12] N. Zhao, Y. Zhong, M.L. Huang, H.T. Ma, X.P. Liu, Effect of thermomigration on the growth kinetics of Cu6Sn5 at liquid-solid interfaces in Cu/Sn/Cu solder joints, 64(16) 特刊SI: 166601, 2015.

[13] M.L. Huang, Applications of synchrotron radiation real-time imaging technology in characterizing the reliability of micro bumps in electronic packaging, 2015 China Semiconductor Technology International Conference，2015. 特邀报告

[14] J.F. Zhao, M.L. Huang, N. Zhao, Z.J. Zhang, Effect of Sn grain orientation on Cu diffusion in SnAgCu solder interconnect undergoing electromigration, 16th International Conference on Electronic Packaging Technology, August 11-14, Changsha, pp. 1275-1278, 2015.

[15] Yawei Liu; Mingliang Huang; Feifei Huang; Ning Zhao, Effects of stirring speed on composition and morphology of non-cyanide co-electroplating Au-Sn thin films, 16th International Conference on Electronic Packaging Technology Changsha, August 11-14, pp. 1283-1286, 2015.

[16] Liwei Xu; Mingliang Huang; Quanbin Yao; Yong Wang; Binhao Lian, Effect of Cu on interfacial reaction in high-lead solder bumps, 16th International Conference on Electronic Packaging Technology Changsha, August 11-14, pp. 1279-1282, 2015.

[17] Ning Zhao; Yi Zhong; Mingliang Huang; Haitao Ma, Interfacial reactions in Cu/Sn/Cu(Ni) systems during soldering under temperature gradient, 16th International Conference on Electronic Packaging Technology, August 11-14, pp. 1263-1266, 2015.

[18] Yi Zhong; Mingliang Huang; Haitao Ma; Ning Zhao, Synchrotron radiation in situ study on liquid-solid thermomigration in Cu/Sn/Ni solder joint, 16th International Conference on Electronic Packaging Technology, August 11-14, pp. 1271-1274, 2015.

[19] J.X. Liu, M.L. Huang, N. Zhao, L.W. Zhang. Microstructure and Mechanical Properties of Al/Sn-Zn-X/Cu Solder Joints, 16th International Conference on Electronic Packaging Technology, August 11-14, pp. 1267 - 1270, 2015.

[20] 黄明亮, 张志杰, 冯晓飞, 赵宁, 液-固电迁移Ni/Sn-9Zn/Ni焊点反极性效应研究, 金属学报, 51 (1), pp. 93-99, 2015.

[21] 黄明亮，冯晓飞，赵建飞，张志杰，Cu/Sn-58Bi/Ni焊点液-固电迁移下Cu和Ni的交互作用，中国有色金属学报（The Chinese Journal of Nonferrous Metals）,25(4),2015.

2014年发表论文目录

[1] M. L. Huang, F. Yang, Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate, Scientific Reports, 4, p.7117, 2014.

[2] X.Y. Liu, M.L. Huang, N. Zhao, L. Wang, Liquid-state and solid-state interfacial reactions between Sn–Ag–Cu–Fe composite solders and Cu substrate, Journal of Materials Science: Materials in Electronics, 25, pp. 328-337, 2014.

[3] M.L. Huang, Q. Zhou, N. Zhao, X.Y. Liu, Z.J. Zhang, Reverse polarity effect and cross-solder interaction in Cu/Sn-9Zn/Ni interconnect during liquid-solid electromigration, Journal of Materials Science, 49, pp. 1755-1763, 2014.

[4] L. Qu, N. Zhao, H.J. Zhao, M.L. Huang, H.T. Ma, In situ study of the real-time growth behavior of Cu6Sn5 at the Sn/Cu interface during the soldering reaction, Scripta Materialia, 72-73, pp. 43-46, 2014.

[5] M. L. Huang, X. L. Hou, N. Kang, Y. C. Yang, Microstructure and interfacial reaction of Sn–Zn–x(Al,Ag) near-eutectic solders on Al and Cu substrates, J Mater Sci: Mater Electron 25, pp. 2311–2319, 2014.

[6] M.L. Huang, F. Yang, N. Zhao, Y.C. Yang, Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in sub-50 μm Sn-Ag-Cu solder bumps, Journal of Alloys and Compounds, 602, pp. 281–284, 2014.

[7] L. Qu, N. Zhao, H.T. Ma, H.J. Zhao, M.L. Huang, In situ study on the effect of thermomigration on intermetallic compounds growth in liquid-solid interfacial reaction. Journal of Applied Physics, 115(20), p. 204907, 2014.

[8] M.L. Huang, Z.J. Zhang, S.M. Zhou, and L.D. Chen, Stress relaxation and failure behavior of Sn-3.0Ag-0.5Cu flip chip solder bumps undergoing electromigration, Journal of Materials Research, 29, pp. 2556-2564, 2014.

[9] M.L. Huang, F.F. Huang, J.L. Pan, T.X. Zhang, Composition control of co-electroplating Au–Sn deposits using experimental strategies, Journal of Materials Science: Materials in Electronics, 25, pp. 4933-4942, 2014.

[10] M.L. Huang, Z.J. Zhang, H.T. Ma, L.D. Chen, Different Diffusion Behavior of Cu and Ni Undergoing Liquid-solid Electromigration, Journal of Materials Science & Technology, 30(12), pp. 1235-1242, 2014.

[11] N. Zhao, M. L. Huang, H. T. Ma, F. Yang, Z.J. Zhang, Influence of rare earth Ce addition on the microstructure, properties and soldering reaction of pure Sn, Metals and Materials International, 20(5), pp. 953-958, 2014.

[12] M.L. Huang, Electromigration Reliability of Lead-free Solder Interconnects, ECS Transactions, 60(1), pp. 811-816, 2014. 特邀报告

[13] M.L. Huang, F. Yang, N. Zhao, X.H. Liu, J.Y. Wang, Study on size effect and cross-interaction in Cu/Sn/Ni-P interconnects, 15th International Conference on Electronic Packaging Technology, August 12-15, Chengdu, China, pp. 429-432, 2014.

[14] M.L. Huang, F. Zhang, F. Yang, N. Zhao, Effect of electromigration on the tensile strength of Cu/Sn-9Zn/Cu solder interconnects, 15th International Conference on Electronic Packaging Technology, August 12-15, Chengdu, China, pp. 1190-1193, 2014.

[15] M.L. Huang, Z.J. Zhang, N. Zhao, X.F. Feng. Reverse polarity effect in Cu/Sn-9Zn/Ni interconnect under 2 × 104 A/cm2 at 230 oC. 15th International Conference on Electronic Packaging Technology, August 12-15, Chengdu, China, 2014.

[16] S. Li, Y. Du, L. Qu, A. Kunwar, J.H. Sun, J.H. Liu, N. Zhao, M.L. Huang, H.T. Ma. The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows. 15th International Conference on Electronic Packaging Technology, August 12-15, Chengdu, China, 2014.

[17] Q. Zhou, Y. Zhou, X. Qin, X.J. Wang, M.L. Huang, Different diffusion behavior of Cu、Ni and Zn atoms in Cu/Sn-9Zn/Ni interconnects under L-S electromigration, 15th International Conference on Electronic Packaging Technology, August 12-15, Chengdu, China, 2014.

2013年发表论文目录

[1] N. Zhao, X. Y. Liu, M. L. Huang, H. T. Ma, Characters of multicomponent lead-free solders, Journal of Materials Science-Materials in Electronics, 24(10), pp. 3925-3931, 2013/10.

[2] M. L. Huang, Q. Zhou, N. Zhao, Z. J. Zhang, Abnormal Diffusion Behavior of Zn in Cu/Sn-9 wt.%Zn/Cu Interconnects During Liquid-Solid Electromigration, Journal of Electronic Materials, 42(10), pp. 2975-2982, 2013.

[3] M.L. Huang, Z.J. Zhang, N. Zhao, Q. Zhou, A synchrotron radiation real-time in situ imaging study on the reverse polarity effect in Cu/Sn–9Zn/Cu interconnect during liquid–solid electromigration, Scripta Materialia, 68(11), pp. 853-856, 2013.

[4] M.L. Huang, Q. Zhou, N. Zhao, L.D. Chen, Interfacial microstructure and mechanical properties of In-Bi-Sn lead-free solder, Journal of Materials Science: Materials in Electronics, 24(7), pp. 2624-2629, 2013.

[5] M.L. Huang, Z.J. Zhang, N. Zhao, X.F. Feng, Study on Liquid-Solid Electromigration in Cu/Sn-9Zn/Cu Interconnect Using Synchrotron Radiation Real-Time in Situ Imaging Technology, 14th International Conference on Electronic Packaging Technology, August 11-14, Dalian, China, pp. 126-129, 2013.

[6] M.L. Huang, T.X. Zhang, N. Zhao, T.T. Jiao, Interfacial Reactions of Co-electrodeposited Eutectic Au-Sn Solder Bumps on Ni and Cu Substrates, 14th International Conference on Electronic Packaging Technology, August 11-14, Dalian, China, pp. 225-228, 2013.

[7] M.L. Huang, T. Liu, N. Zhao, H. Hao, Interfacial Reaction in Cu/Sn/Cu Fine Pitch Interconnect during Soldering, 14th International Conference on Electronic Packaging Technology, August 11-14, Dalian, China, pp. 382-385, 2013.

[8] M.L. Huang, F. Yang, N. Zhao, F. Zhang, Dissolution and Precipitation of Ag3Sn Plates in Ultra Fine Solder Joints Using Synchrotron Radiation Real-time Imaging Technology, 14th International Conference on Electronic Packaging Technology, August 11-14, Dalian, China, pp. 822-825, 2013.

[9] M.L. Huang, X.L. Hou, H.T. Ma, J. Zhao, Y.C. Yang, Interfacial Reaction and Mechanical Properties of Al/Sn-Zn-Ni/Cu Solder Joints, 14th International Conference on Electronic Packaging Technology, August 11-14, Dalian, China, pp. 879-882, 2013.

[10] M.L. Huang, Q. Zhou, H.T. Ma, J. Zhao, Effect of Liquid-solid Electromigration on Interfacial Reaction in Cu/Sn-9Zn/Cu Solder Joint, 14th International Conference on Electronic Packaging Technology, August 11-14, Dalian, China, pp. 1090-1093, 2013.

[11] M.L. Huang, S. Liu, N. Zhao, H. Long, J.H. Li, W.Q. Hong, Drop Failure Modes of A Wafer-Level Chip-Scale Packaging, 14th International Conference on Electronic Packaging Technology, August 11-14, Dalian, China, pp. 1094-1098, 2013.

[12] X.Y. Liu, M.L. Huang, N. Zhao, L. Wang, Effect of Fe addition to Sn-3Ag-0.5Cu solder on interfacial reactions during aging, 14th International Conference on Electronic Packaging Technology, August 11-14, Dalian, China, pp. 400-402, 2013.

[13] L.D. Chen, Y. Feng, X.Y. Liu, M.L. Huang, Effects of Temperature and Current Density on (Au,Pd,Ni)Sn4 Redistribution and Ni-P Consumption in Ni/Sn3.0Ag0.5Cu/ENEPIG Flip Chip Solder Joints, 14th International Conference on Electronic Packaging Technology, August 11-14, Dalian, China, pp. 1064-1069, 2013.

[14] L.L. An, H. Ma, L. Qu, J. Wang, J.H. Liu, M.L. Huang, The Effect of Laser-soldering Parameters on the Sn-Ag-Cu/Cu Interfacial Reaction, 14th International Conference on Electronic Packaging Technology, Dalian, China, pp. 264-267, 2013.

[15] L. Qu, H. Ma, H.J. Zhao, N. Zhao, A. Kunwar, M.L. Huang, The nucleation of Ag3Sn and the growth orientation relationships with Cu6Sn5, 14th International Conference on Electronic Packaging Technology, August 11-14, Dalian, China, pp. 377-381, 2013.

[16] X.Y. Liu, M.L. Huang, N. Zhao, Interfacial reactions between Sn-Ag-Cu-Fe composite solder and Cu substrate, 3rd International Conference on Mechatronics and Intelligent Materials (MIM 2013), May 18-19, Xishuangbanna, China, pp. 138-141, 2013.

[17] M.L. Huang, F. Yang, N. Zhao, X.Y. Liu, Solder Volume Effect on Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder Balls and Cu Substrates - Experiment & Simulation, ECS Transactions, 52 (1), pp. 753-758, 2013.

[18] 赵宁，黄明亮，马海涛，潘学民，刘晓英，液态Sn-Cu钎料的黏滞性与润湿行为研究，物理学报，62(8)，p. 086601，2013．

[19] 黄明亮，周少明，陈雷达，张志杰，Ni-P消耗对焊点电迁移失效机理的影响，金属学报，49(1)，pp. 81-86，2013．

[20] 黄明亮，陈雷达，赵宁，Cu-Ni交互作用对Cu/Sn/Ni焊点液-固界面反应的影响，中国有色金属学报，23(4)，pp. 1073-1078，2013．

2012年发表论文目录

[1] M.L. Huang, J.L. Pan, H.T. Ma, N. Zhao, Interfacial reactions of sequentially electroplated Au/Sn/Au films on Si chips, Materials Science and Technology, 28(7), pp. 837-843, 2012.

[2] M.L. Huang, S.M. Zhou, L.D. Chen, Electromigration-induced interfacial reactions in Cu/Sn/electroless Ni-P solder interconnects, Journal of Electronic Materials, 41(4), pp. 730-740, 2012.

[3] H.T. Ma, L. Qu, M.L. Huang, L.Y. Gu, N. Zhao, L. Wang, In-situ study on growth behavior of Ag3Sn in Sn–3.5Ag/Cu soldering reaction by synchrotron radiation real-time imaging technology, Journal of Alloys and Compounds, 537, pp. 286-290, 2012.

[4] M.L. Huang, N. Kang, Q. Zhou, Y. Z. Huang, Effect of Ni Content on Mechanical Properties and Corrosion Behavior of Al/Sn-9Zn-xNi/Cu joints, Journal of Materials Science & Technology, 28(9), pp. 844-852, 2012.

[5] H.T. Ma, J. Wang, L. Qu, L.L. An, L.Y. Gu, M.L. Huang, The study on the rapidly-solidified Sn-0.7Cu lead-free solders and the interface reactions with Cu substrate, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 13-16, Guilin, China, pp. 361-365, 2012.

[6] H.T. Ma, L. Qu, H.J. Zhao, J. Wang, L.Y. Gu, L. L. An, M.L. Huang, In-situ study on the formation and evolution behavior of voids at the interface during soldering process by synchrotron radiation real-time imaging technology, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 13-16, Guilin, China, pp. 380-384, 2012.

[7] H.T. Ma, L.L. An, L. Qu, J. Wang, L.Y. Gu, M.L. Huang, Interfacial Reaction between Sn-9Zn/Sn Double Layers Solder and Cu, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 13-16, Guilin, China, pp. 393-397, 2012.

[8] X.Y. Liu, M.L. Huang, N. Zhao, Effect of Cu6Sn5 particles on microstructure formation and mechanical properties of Sn-58Bi solder, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 13-16, Guilin, China, pp. 423-425, 2012.

[9] T. Liu, M.L. Huang, N. Zhao, Interfacial Reactions between Cu Single Crystals and Lead-free Solders during Solid-State Aging, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 13-16, Guilin, China, pp. 494-498, 2012.

[10] F. Yang, M.L. Huang, N. Zhao, Study on Short Time Interfacial Reactions between Sn-3.0Ag-0.5Cu Solder Balls and ENEPIG Pads, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 13-16, Guilin, China, pp. 499-502, 2012.

[11] X.H. Wang, M.L. Huang, F. Yang, N. Zhao, Simulation of IMC Layer Growth and Cu Consumption in Sn-Ag-xCu/Cu Solder Joints during Reflow, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 13-16, Guilin, China, pp. 823-827, 2012.

[12] S. Pan, M.L. Huang, N. Zhao, S.M. Zhou, Z.J. Zhang, Dissolution of Substrates in Line-type Cu/Sn/Cu and Cu/Sn/Ni Interconnects under Current Stressing, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 13-16, Guilin, China, pp. 1399-1402, 2012.

[13] Q. Zhou, M.L. Huang, N. Zhao, Z.J. Zhang, Effects of Cooling Rate and Solder Volume on the Formation of Large Ag3Sn Plates in Sn-Ag Based Solder Joints, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 13-16, Guilin, China, pp. 1403-1406, 2012.

[14] M.L. Huang, Solder Volume Effect on Interfacial Reaction of Sn-3.0Ag-0.5Cu Solder Balls Experiment & Simulation, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 13-16, Guilin, China, 2012. 特邀报告.

[15] F. Yang, L.W. Liu, Q. Zhou, T. Liu, M.L. Huang, Effect of Solder Volume on Interfacial Reaction between Sn-3.0Ag-0.5Cu Solder Balls and the Substrates, ECS Transactions, 44 (1), pp. 885-890, 2012.

[16] 刘晓英，马海涛，罗忠兵，赵艳辉，黄明亮，王来，Fe粉对Sn3Ag0.5Cu复合钎料组织及性能的影响，中国有色金属学报，22(4)，pp. 1169-1176，2012．

[17] 黄明亮，陈雷达，周少明，赵宁，电迁移对Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P倒装焊点界面反应的影响，物理学报，61(19)，pp. 198104(1-9)，2012．

[18] 陈雷达，周少明，黄明亮，电迁移对Ni/Sn/Ni-P焊点界面反应的影响，稀有金属材料与工程，41(10)，pp. 1785-1789，2012．

[19] 黄明亮，陈雷达，周少明，电迁移对Ni/Sn3.0Ag0.5Cu/Cu焊点界面反应的影响，金属学报，48(3)，pp. 321-328，2012．

[20] 潘剑灵，黄明亮，赵宁，分步法电镀制备的Au-Sn共晶凸点的微观组织，中国有色金属学报，22(7)，pp. 2016-2022，2012．

[21] 程从前，黄明亮，赵杰，薛冬峰，均恒磁场对Cu与液态SnZn合金间化合物层结晶行为的影响(英文)，中国有色金属学报(英文版)，22(9)，pp. 2312-2319，2012．　

Applied Physics Letters, Journal of Materials Research, Journal of Electronic Materials, Journal of Alloys and compounds, IEEE Trans. On Advanced Packaging等刊物上发表的学术论文。

SCI统计：已被引用250次。

2011年发表论文目录

1．M.L. Huang, Y. Liu, J.X. Gao, Interfacial Reaction between Au and Sn films electroplated for LED bumps, Journal of Materials Science: Materials in Electronics, 22, 2011, pp. 193-199 DOI 10.1007/s10854-010-0113-z

2．M.L. HUANG, Y.Z. HUANG, H.T. MA, and J. ZHAO, Mechanical Properties and Electrochemical Corrosion Behavior of Al/Sn-9Zn-xAg/Cu Joints, Journal of ELECTRONIC MATERIALS, 40(3), 2011, pp.315-323, DOI: 10.1007/s11664-010-1459-y, 2010年12月Online

2010年发表论文目录

1．L. D. Chan, M. L. Huang, S.M. Zhou, Effect of electromigration on intermetallic compound formation in line-type Cu/Sn/Cu interconnect, Journal of Alloys and Compounds, 504, 2010, pp.535-541.

2．X.Y. Liu, M.L. Huang, C.M.L. Wu, L. Wang, Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder, Journal of Materials Science: Materials in Electronics, 21, 2010, pp.1046-1054, DOI 10.1007/s10854-009-0025-y.

3．Xiaoying Liu, Mingliang Huang, Yanhui Zhao, C.M.L. Wu, Lai Wang, The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu during soldering, Journal of Alloys and Compounds, Vol. 492, 2010, pp. 433-438. (SCI)

4．L. D. Chan, M. L. Huang, S.M. Zhou, Effect of electromigration on intermetallic compound formation in Cu/Sn/Cu and Cu/Sn/Ni interconnects, The 60th Electonic Components and Technology Conference, IEEE, Nevada, USA, June 1-4, 2010 pp.176-181. 大会论文及口头报告

5．黄明亮，柏冬梅, 化学镀Ni-P与Sn-3.5Ag在钎焊及时效过程中的界面反应, 中国有色金属学报,vol. 20, No.6, 2010年6月，pp.1189-1194

6．柏冬梅，黄明亮，镀液pH值及浓度对铝基表面化学镀镍-磷镀层磷含量及镀速的影响，机械工程材料，2010年6月，第34卷第6期，pp.28-32。

7．张福顺，黄明亮，潘剑灵，王来，无氰金-锡合金电镀液的成分优化及电流密度确定，机械工程材料，2010年11月，第34卷第11期，pp.50-54。

8．M. L. Huang, L. Wang, J. Zhao, Interfacial Reactions and Reliability Issues of Fine Pitch Flip-Chip Lead-free Solder Joints, 2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE Catalog Number: CFP10553-CDR, August 16-19, 2010, Xi’an, China （国际会议ICEPT-HDP特邀报告）

9．Huan Liu, Mingliang Huang, Haitao Ma, Yipeng Cui, Comparative Study of Interfacial Reactions of High-Sn Pb-free Solders on (001) Ni Single Crystal and on Polycrystalline Ni, 2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE Catalog Number: CFP10553-CDR, August 16-19, 2010, Xi’an, China, pp. 293-298. （国际会议论文）

10．Jianling Pan, Mingliang Huang, Au–Sn Co-electroplating solution for Flip Chip-LED Bumps, 2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE Catalog Number: CFP10553-CDR, August 16-19, 2010, Xi’an, China, pp. 283-287.

11．Nanzi Fan, Mingliang Huang, Lai Wang, Electroless Nickel-Boron Plating on Magnesium Alloy, 2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE Catalog Number: CFP10553-CDR, August 16-19, 2010, Xi’an, China, pp. 288-292.

12．Luwei Liu, Mingliang Huang, Effect of Solder Volume on Interfacial Reactions between Sn3.5Ag0.75Cu Solder Balls and Cu Pad, 2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE Catalog Number: CFP10553-CDR, August 16-19, 2010, Xi’an, China, pp. 299-304.

13．Shaoming Zhou, Mingliang Huang, Leida Chen, Electromigration-induced interfacial reactions in line-type Cu/Sn/ENIG interconnect, 2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE Catalog Number: CFP10553-CDR, August 16-19, 2010, Xi’an, China, pp. 467-471.

14．Yingzhuo Huang, Mingliang Huang, Ning Kang, Mechanical Property and Electrochemical Corrosion Behavior of Al/Sn-9Zn-XNi/Cu Joints, 2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE Catalog Number: CFP10553-CDR, August 16-19, 2010, Xi’an, China, pp. 422-428.

15．Song Ye, Mingliang Huang, Leida Chen, Xiaoying Liu, Electromigration of 300 μm diameter Sn-3.0Ag-0.5Cu lead-free bumps in flip chip package, 2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE Catalog Number: CFP10553-CDR, August 16-19, 2010, Xi’an, China, pp. 1132-1137.

16．Leida Chen, Mingliang Huang, Shaoming Zhou, Song Ye, Effect of electromigration on the Cu-Ni cross-interaction in line-type Cu/Sn/Ni interconnect, 2010 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE Catalog Number: CFP10553-CDR, August 16-19, 2010, Xi’an, China, pp. 324-329.

所获奖励

教育部新世纪优秀人才（2006年入选）；

辽宁省“百千万人才工程” 百人层次人才（2009年入选）；

德国洪堡基金奖（洪堡学者）（2004年2月~2006年2月）；

辽宁省科学技术发明二等奖；

2005年获得IEEE在新加坡主办的国际电子封装技术会议(EPTC)的最优会议论文奖。

2009年获得ICEPT-HDP国际电子封装技术会议优秀会议论文奖。

发明专利

1. 黄明亮，潘剑灵，卿湘勇，马海涛，王来，一种无氰Au-Sn合金电镀液的共沉积电镀方法，发明专利申请号：200910187274.5。

2. 赵杰，黄明亮，于大全，王来，锡锌基含稀土元素的无铅钎料合金，已授权的中国发明专利号: ZL02109623.6，授权公告日:2004年11月17日。

3. 马海涛，王来，马洪列，黄明亮，赵杰，一种SnZn系无铅钎料用助焊剂及其制备方法，已授权的中国发明专利号: ZL200710010114.4，授权公告日:2009年01月28日。

全国各地天气预报查询